Pasta pendingin processor yang di oleskan padabagian heat-sink ke Chipset untuk mendinginkan CPU, GPU, Mainboard, VGA, dst. Product parameters :-Weight : 1gram-Heat transfer coefficient > 1.93 W/m k-Thermal impedance < 0.225 C - W/in2-The proportion of > 2 g/cm3-Concentration to 380 ± 10 1/10mm-Instantaneous temperature resistant to 50 ~ 300 °C-Working temperature - 30 ~ 280°C Ingredient-Silicon compounds - 50%-Carbon compounds - 30%-Metal oxide compound - 20%
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