Busa Poles Mobil Koch Chemie Micro Cut Pad 126 x 23 mm

High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut amp; Finish P3.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety. Compression hardness: 10. Abrasiveness: 5. Keterangan : - Sebaiknya konfirmasi dahulu mengenai ketersediaan stok sebelum memesan